Hello Mi Fans,
Recently, Xiaomi officially released the teardown of Redmi Note 8 Pro for a better insight of the components in the phone.


Here is the teardown of Redmi Note 8 Pro





The purple line denotes the power button & volume rocker with dustproof and splashproof protection which gives the Redmi Note 8 Pro its IP52 certification for water resistance. The blue outline is the external sound chamber, which also acts as an independent heat dissipation unit. Next is the hidden lens design in green outline and on the back cover a foam seal along the edges to increase protection for the camera unit.




The matte black main board cover has a large area of heat dissipation covering the main board area to the battery compartment, and can quickly dissipates heat outlined in blue. The yellow outline is the coil for the NFC chip, with 30% faster transaction speed and better security.





The light & distance sensor is marked in purple. As for the camera module cover (green dot), it comes with a concealed rear fingerprint sensor integrated with the camera cover to avoid extra holes in the back cover of the mobile phone, increases the strength of the back shell structure and enhances the look of the rear.




The camera  module has a dual cluster layout. The red dot is the primary camera, the 64MP Samsung GW1 sensor that measures 1/1.7" in size with 1.6um pixel size. The yellow dot is the 2MP depth of field lens of 1.75um pixel size and the blue dot is the 8MP super wide-angle camera, with a wide 120° field of view, making scenery and buildings more visible. The second cluster is the purple dot showing the 2MP super macro lens with 2CM focal length and 1.75um pixel size together with the super bright dual tone LED flash unit. The green dot is the 20MP front camera, using Samsung S5K3T1 sensor.


In the red box is the NFC chip, the green box is MediaTek Power Management & Audio Decoder chip and in purple is MediaTek 6186M RF Chip with the Skyworks RF Amplifier in yellow outline.


Here comes the epic chipset in yellow, the MediaTek Helio G90T professional game mobile processing platform with SK Hynix LPDDR4X 2133MHZ memory + UFS 2.1 flash stack in red. In the purple box is the audio amplifier chip, the MediaTek Wi-Fi chip in green, the Qualcomm parallel charge chip is in blue while the pink box is the MediaTek MT6360 power management chip. The parallel charge chip is responsible for Quick Charge 3.0 and the Redmi Note 8 Pro also supports QC4.0+, MediaTek Pump Express PE4.0 and PD3.0 power delivery


The red dot shows the hybrid SIM card tray, which supports dual Nano-SIM card or Nano-SIM + TF expansion card combination. The yellow dot is the Type-C interface and finally 3.5mm headphone jacks designed with a sealed rubber ring for dustproof and splashproof is shown with the blue dot

Next, you will see the antenna placement. There are two 2G/3G/4G antennas, one on top and one on the bottom in yellow, then Wi Fi / GPS / Bluetooth 3-in-1 antenna in red on the top left corner. Of interest are the four corners (in green), which are there to reinforce the phone in case of a drop. In pink is the removable adhesive tape, which makes battery replacement simple, avoiding safety hazards. In the blue outline is the copper pipe for the LiquidCool system, cooling the processor and power management chip and helping to bring the temperature 4-6°C lower during gaming and charging while gaming. As for cyan line this is the WiFi-X an "anti-lock" antenna for smart switching to avoid network lag during gaming  The blue dot is the 4500mAh high capacity battery, which supports 18 watt fast charging.

We have seen a lot of improvements on its internal design and material.

Do you have any questions now you’ve seen the inside of the Redmi Note 8 Pro?

For any doubt just write your comments down below!


So are you excited for the Redmi Note 8 Pro?